Wave soldering is the formation of molten solder solder wave to solder components; reflow soldering is the formation of high temperature hot air reflow melting solder to solder components.
Therefore, reflow soldering is suitable for patch electronic components, and wave soldering is suitable for pin electronic components.
Reflow soldering: refers to the melting of solder paste pre-coated on the pad by heating to realize the electrical interconnection between the pins or solder ends of electronic components pre-mounted on the pad and the pad on the pcb, so as to achieve the purpose of soldering the electronic components on the PCB board. Reflow soldering is generally divided into preheating zone, heating zone and cooling zone.
Reflow Soldering Process: Printing Solder Paste> Mount Components> Reflow Soldering> Cleaning
Wave soldering: Use a pump to spray the molten solder into a solder wave, and then pass the pins of the electronic components that need to be soldered through the solder wave to realize the electrical interconnection between the electronic components and the PCB board. A wave soldering is divided into four parts: spray, preheating, tin furnace and cooling.
Wave soldering process: plug-in> flux application> preheating> wave soldering> cutting corners> check.
wave soldering and reflow soldering of distinction:
(1) Wave soldering is the formation of molten solder solder wave to solder components; reflow soldering is the formation of high-temperature hot air reflow melting solder to solder components.
(2) During reflow soldering, there is solder before pcb is put on the furnace. After soldering, the coated solder paste is melted for soldering. During wave soldering, there is no solder before pcb is put on the furnace. The solder wave generated by the soldering machine coats the solder on the pad to be soldered to complete soldering.
(3) Reflow soldering is suitable for SMD electronic components, and wave soldering is suitable for pin electronic components.